Premium Quality Build: Made of high-strength metal with precision CNC machining for durability and stability during reballing. Dual-Sided Design: Features two magnetic working sides — one for positioning NAND chips and another for small ICs, increasing efficiency. Strong Magnetic Base: Ensures steady chip placement, preventing movement during soldering or heating. Wide Compatibility: Suitable for iPhone, iPad, and Android NAND/CPU reballing and chip repair. Professional Use: Ideal for advanced technicians, mobile repair labs, and BGA rework professionals. Heat Resistant: Designed to withstand high reflow temperatures during hot air or rework station use. Precision Engineering: Offers smooth operation and accurate alignment for clean solder ball placement. Portable & Convenient: Compact size makes it easy to carry and store in any repair workstation. Overview






| Weight |
0.090 kg |
|---|

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