AMAOE 10GA-00009-01/XU9001-009 STENCIL

1. Premium Japanese Steel (SUS301)

Constructed from selected high-tensile Japanese stainless steel, the stencil features remarkable elastic properties. It can withstand repeated bending and flexing without losing its original flat profile, ensuring a perfectly flush sit on the PCB motherboard during paste application.

2. Advanced Square-Centered Rounded Openings

Unlike traditional circular stencil holes that easily trap solder paste, the XU9001-009 features proprietary square apertures with microscopic rounded corners. This geometry maximizes paste deposit consistency and ensures that 100% of the solder paste releases cleanly onto the BGA pads when lifting the stencil.

3. Optimized 0.12mm Thickness

A critical vector in micro-soldering is avoiding bridging while ensuring adequate ball height. The 0.12mm gauge thickness delivers the ideal volume of solder paste, eliminating the risk of micro-bridging under high-density components and reducing the need for manual post-reflow cleanups.

4. High Thermal Stability & Anti-Bulging

The chemical and structural composition allows the stencil to absorb direct heat from hot air rework stations without severe localized thermal expansion. This minimizes the common issue of the stencil "bowing" or "bulging" mid-process, which typically causes ruined solder joints.