AMAOE EXYNOS1580 / SAMSUNG E8855 stencil designed for precise mobile IC reballing and chip-level motherboard repair.
High-quality BGA rework stencil for Exynos 1580 and Samsung E8855 chipset repair and maintenance.
Professional-grade AMAOE stencil for accurate solder ball alignment in Samsung processor reballing.
Durable stainless steel stencil for Exynos 1580 / E8855 IC chip repair and reballing applications.
Perfect tool for mobile motherboard technicians working on Samsung E8855 and Exynos 1580 chips.
Laser-cut precision stencil ensures stable and accurate solder paste placement for BGA rework.
Ideal for chip-level repair shops handling Samsung Exynos 1580 mobile processor repairs.
Easy-to-use reballing stencil for professional smartphone motherboard IC restoration work.
Designed for high-accuracy BGA reballing in Samsung E8855 and Exynos 1580 chipsets.
Essential repair tool for mobile technicians performing advanced Samsung motherboard IC repairs.
Overview
Amaoe 0.12mm CPU BGA Reballing Stencil for Samsung Exynos 1580
Package includes:
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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