AMAOE IPBB-3 IPXS-17 stencil is a high-precision BGA reballing tool designed for professional mobile and PCB repair work.
Durable stainless steel AMAOE stencil for IPBB-3 and IPXS-17 chips ensures accurate solder ball placement and easy rework.
This AMAOE IPXS-17 stencil is ideal for iPhone XS motherboard chip repair and advanced micro soldering tasks.
High-quality AMAOE IPBB-3 stencil offers precise alignment for efficient IC and BGA reballing operations.
Professional-grade AMAOE stencil designed for mobile repair technicians working on IPBB-3 and IPXS-17 boards.
AMAOE IPXS-17 stencil helps in clean and accurate solder paste application for chip-level repairs.
Perfect reballing stencil for iPhone XS and IPBB-3 boards, ensuring reliable and consistent repair results.
AMAOE IPBB-3 IPXS-17 stencil is built for durability and precision in electronics repair workshops.
Easy-to-use AMAOE stencil improves efficiency in BGA rework and motherboard repair processes.
Essential repair tool for technicians, the AMAOE IPXS-17 stencil supports accurate chip restoration and soldering work.
Overview
Amaoe IPBB:3 Baseband / Hard Disk / WiFi / NFC / Code Chip BGA Reballing Stencil for iPhone XS-17PM - Half Carve Through Edition
Package includes:
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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