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The AMAOE MAC 13 is a high-precision BGA (Ball Grid Array) reballing stencil specifically engineered for the professional repair of Apple MacBook logic boards. It is part of the broader AMAOE "MAC" series, which provides specialized steel meshes for different generations of Apple silicon. The specific designation MAC 13 is intended for the Apple M5 CPU universal series. Precision Engineering: The stencil features ultra-precise, laser-cut square apertures that align perfectly with the solder pads of the M5 CPU. This ensures that solder paste or solder balls are placed exactly where needed, preventing bridges or short circuits between adjacent pins. Material Quality: Constructed from premium Japanese stainless steel, the stencil is designed to withstand the repeated heating and cooling cycles of hot air rework stations without warping or losing its shape. Optimal Thickness: At a thickness of 0.12 mm, it provides the ideal volume for solder deposits, balancing the need for sufficient connection material with the requirement for fine-pitch accuracy. Reusability: The professional-grade material and robust construction allow for multiple uses, making it an essential, long-term tool for chip-level motherboard technicians. While this stencil is a highly specialized tool, it is essential to ensure you are matching the stencil model to the exact chip version on the logic board. The "MAC" series includes multiple versions (e.g., MAC 10 for M2, MAC 11 for M3, MAC 12 for M4); using the incorrect stencil will result in poor alignment and failed reballing attempts. Always verify the specific chip model number on your board against the stencil's intended compatibility. Are you currently working on a specific MacBook M5 logic board repair, or would you like to know more about the best practices for cleaning and maintaining these stencils? Overview
Feature
Specification / Detail
Product Name
AMAOE MAC 13 BGA Reballing Stencil
Primary Application
MacBook Logic Board Repair (CPU Reballing)
Compatibility
Apple MacBook M5 CPU Universal Series
Material
High-Quality Stainless Steel
Thickness
0.12 mm
Hole Geometry
Square (Precision laser-cut)
Thermal Resistance
High-temperature resistant (warp-resistant)
Durability
Reusable; resistant to deformation
Design
Slim profile for optimal solder paste/ball application
Key Features
Important Usage Note
| Weight |
0.020 kg |
|---|
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