AMAOE Magic V5 Stencil is a high-precision BGA reballing template designed for professional mobile motherboard and IC chip repair.
Built with durable stainless steel, this stencil ensures accurate solder ball placement for reliable chip-level repairing.
Perfect for technicians and repair shops, the Magic V5 stencil supports precise CPU, GPU, and IC reballing work.
The ultra-thin, heat-resistant design helps achieve clean and consistent reballing results every time.
Ideal for smartphone motherboard repair, this stencil improves efficiency and reduces rework during micro-soldering.
The AMAOE Magic V5 is a must-have tool for advanced mobile phone repair and chip replacement tasks.
Engineered for accuracy, it provides stable positioning and professional-grade performance for repair experts.
Suitable for both beginners and professionals, it simplifies complex reballing and chip repair processes.
Compact, lightweight, and easy to use, this stencil is perfect for daily use in repair workshops.
Overview
Amaoe 0.12mm Inline Seat Sub-Board BGA Reballing Stencil for Honor Magic V5
Package includes:
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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