Precision AMAOE P3-012 stencil designed for accurate Huawei P30 Pro IC and CPU reballing, ideal for professional mobile repair technicians.
High-quality stainless steel stencil for Huawei P30 Pro motherboard repair, ensuring perfect solder ball alignment every time.
AMAOE P3-012 reballing stencil offers ultra-thin, heat-resistant design for safe and efficient chip rework.
Professional BGA reball stencil made specifically for Huawei P30 Pro, perfect for repair shops and advanced technicians.
Durable and laser-cut stencil that improves precision during IC reballing and motherboard repair tasks.
Compact and easy-to-use reballing stencil for Huawei P30 Pro chip repair and micro-soldering work.
Reliable mobile repair tool that helps restore damaged IC chips with high accuracy and consistency.
Designed for GSM technicians, this stencil ensures faster and cleaner reballing results for Huawei devices.
Premium AMAOE stencil built for repeated use, making it a cost-effective tool for professional repair centers.
Essential Huawei P30 Pro repair accessory for precise BGA soldering and motherboard maintenance.
Overview
Amaoe P3-012 Middle Layer BGA Reballing Tin Plant Stencil Net for Huawei P30 Pro
Feature:
Package includes:
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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