The AMAOE S938U-012 stencil is a precision reballing tool designed specifically for Samsung Galaxy S25 Ultra chipset and IC repair.
High-quality stainless steel construction ensures accurate solder ball placement for reliable Samsung S25 Ultra motherboard repairs.
Perfect for professional technicians, this stencil supports S938U/W/D/B/BE/B2 models for chip-level rework and reballing.
Laser-cut micro holes deliver precise alignment, making BGA and CPU reballing faster and more efficient.
Built for durability and repeated use, ideal for mobile repair shops and service centers.
Designed to simplify complex Samsung S25 Ultra IC repairs with high precision and consistency.
A must-have tool for advanced smartphone repair and motherboard rework tasks.
Helps achieve clean, accurate soldering results while reducing repair time.
Professional-grade stencil suitable for both beginners and expert mobile technicians.
Reliable and compact reballing stencil for precise Samsung Galaxy S25 Ultra chip repairs.
Overview
Amaoe Reverse Middle Layer BGA Reballing Stencil Platform Set for Samsung S25 Ultra S938U/W/D/B/BE/B2
Package includes:
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
Customer Reviews
No reviews yet
Be the first to review this product.