AMAOE X51V-012 Xperia 5 IV Stencil is a high-precision stainless steel reballing stencil designed for accurate BGA rework and chip-level mobile repair.
Specially made for Sony Xperia 5 IV motherboard repairs, this stencil ensures perfect alignment for CPU, GPU, and IC reballing tasks.
Crafted with laser-cut micro holes, the AMAOE stencil provides clean solder ball placement and professional repair results.
Ideal for mobile technicians and repair shops, this stencil supports safe and efficient Xperia 5 IV chip reballing.
The durable stainless steel build offers long-lasting performance for repeated professional use.
Designed for precision soldering, the AMAOE X51V-012 helps restore damaged Xperia 5 IV logic boards quickly.
A must-have tool for chip-level repairing, ensuring stable and accurate BGA solder rework.
Lightweight, compact, and easy to handle, perfect for everyday mobile phone repair work.
Improves repair efficiency and reduces soldering errors during Xperia 5 IV motherboard servicing.
Professional-grade mobile repair accessory for reliable and high-quality Sony Xperia reballing tasks.
AMAOE X51V-012 XPERIA 5 IV STENCIL BGA Reballing Stencil Package includes: Overview
| Weight |
0.020 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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