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The MaAnt 0.12mm Square?Hole BGA Reballing Stencil for the iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max (A18 series) is a precision tool crafted for chip reballing tasks. Engineered with a high-strength alloy steel mesh, its square?hole, chamfered design ensures burr-free tin application. Flexible yet resilient, it withstands heat and frequent use—making it ideal for CPU, NAND, Wi?Fi, Baseband, and NFC component repairs. Overview
Feature
MaAnt 16?Series Only Stencil
Model Coverage
iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
Primary Use Case
Focused reballing for 16-series chips
Hole Size
0.12?mm square
Material
Alloy steel
Durability
High-temperature resistant and flexible
Precision
High accuracy, burr-free
Packaging
Single stencil
| Weight |
0.030 kg |
|---|
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