Mechanic iTin-12 magnetic tin plating platform designed for precise BGA chip reballing.
Professional BGA reballing stencil platform for accurate solder ball planting.
Strong magnetic fixing system keeps IC and stencil stable during reballing.
Ideal for mobile phone motherboard and chip-level repair work.
High-precision tin planting platform for efficient BGA soldering tasks.
Durable metal repair base suitable for professional electronics technicians.
Perfect for IC, CPU, and motherboard reballing applications.
Compact repair workstation tool for mobile and PCB maintenance.
Improves chip positioning and solder ball alignment during repair.
Essential BGA reballing tool for advanced micro-soldering and chip repair.
Overview
Mechanic iTin-12 BGA Reballing Stencil Magnetic Tin Plating Platform
Features:
Package includes:
| Weight |
0.30 kg |
|---|
Mobile
Repairing Tools
Touch/Glass/OCA
Glass
Stencils &
IC
OCA Machine &
Parts
Mobile
Accessories
Software
OCA
Sheets &
Polarizers
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