Mechanic/Amaoe SAM-1 Stencil

The Mechanic/Amaoe SAM-1 is a high-precision BGA reballing stencil specifically engineered for the flagship generation of Samsung devices, primarily the Galaxy S8, S8+, and Note 8 series. It is a critical tool for technicians performing chip-level motherboard repairs, such as CPU transplants or fixing power-on issues.

The SAM-1 is a multi-function stencil that covers the primary integrated circuits (ICs) for the Samsung 8-series flagship ecosystem, including both Global (Exynos) and US/China (Snapdragon) variants.

To ensure a 100% success rate during the reballing process:

1. Preparation: Clean the IC surface thoroughly using a solder wick and flux cleaner. Any residual old solder will cause the stencil to sit unevenly.

2. Paste Application: Use a medium-viscosity solder paste (e.g., Mechanic M9 183°C). Spread evenly with a firm scraper.

3. Heat Control: Set your hot air station to approximately 330°C - 350°C with low airflow. Hold the stencil down with tweezers at the edges to ensure zero movement.

4. Cleaning: After the solder balls have formed and cooled, clean the stencil immediately with 99% Isopropyl Alcohol. Do not let paste harden in the square holes.