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The YCS Professional PCB Pad Cleaning Brush is a specialized tool designed for precision electronics repair. Whether you are a professional technician or a DIY enthusiast, this brush is engineered to handle the delicate nature of iPhone and Android logic boards without causing static damage or physical abrasion. Here is the full product description organized for quick reference.Key Features
Component
Description & Benefit
Anti-Static (ESD) Safe
Designed to prevent electrostatic discharge which can fry sensitive IC chips and CPU components during cleaning.
Precision Bristles
The bristles are stiff enough to remove stubborn burnt flux but soft enough not to scratch the solder mask or pull up delicate pads.
Heat Resistance
Can be used safely near hot air rework stations or while the board is still warm from desoldering.
Slim Profile
The narrow head allows for cleaning in tight spaces, such as under-fill removal around BGA chips.
Ergonomic Grip
Textured handle provides a non-slip grip, essential for high-magnification work under a microscope.
YCS Professional PCB Pad Cleaning Brush for iPhone & Android
Product Overview
Feature
Specification / Detail
Product Name
YCS Professional PCB Pad Cleaning Brush
Primary Use
Removing residual solder, flux, and oxidation from PCB pads.
Compatibility
iPhone, Android, Tablets, and high-density micro-electronics.
Handle Material
Anti-static, heat-resistant composite / Aluminum Alloy.
Bristle Material
High-density Fine Steel Wire / Anti-static Synthetic Fiber.
Weight
Approx. 15g - 25g (Lightweight for precision work).
Length
Ergonomic "pen-style" length (Approx. 130mm - 150mm).
Application & Usage
Task
How the YCS Brush Helps
BGA Reballing
Cleans the "motherboard side" pads after chip removal to ensure a perfectly flat surface for the new chip.
Flux Removal
Works effectively with Isopropyl Alcohol (IPA) to scrub away sticky residue after soldering.
Oxidation Cleaning
Gently removes "black pads" or corrosion caused by liquid damage on mobile devices.
Glue/Underfill Scraping
Helps in the mechanical removal of softened epoxy underfill around iPhone CPUs.
| Weight |
0.060 kg |
|---|
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